Skip to content
Conference · DAC

Toward Advancing 3D-ICs Physical Design: Challenges and Opportunities

Xueyan Zhao, Weiguo Li, Zhisheng Zeng, Zhipeng Huang, Biwei Xie, Xingquan Li*, Yungang Bao · 2025

iMapsynthesisiFPfloorplaniPDNpoweriPLplacementiCTSclockiTOoptimizationiRTroutingiSTAtimingAiEDAdesign dataiPCLlayout modeliMapsynthesisiFPfloorplaniPDNpoweriPLplacementiCTSclockiTOoptimizationiRTroutingiSTAtimingAiEDAdesign dataiPCLlayout model

Why it matters

Xueyan Zhao, Weiguo Li, Zhisheng Zeng, Zhipeng Huang, Biwei Xie, Xingquan Li*, Yungang Bao, Toward Advancing 3D-ICs Physical Design: Challenges and Opportunities , in Proceedings of the 28th Asia and South Pacific Design Automation Confe…

Citation entry

Xueyan Zhao, Weiguo Li, Zhisheng Zeng, Zhipeng Huang, Biwei Xie, Xingquan Li*, Yungang Bao, Toward Advancing 3D-ICs Physical Design: Challenges and Opportunities, in Proceedings of the 28th Asia and South Pacific Design Automation Conference (ASP-DAC), 2025. (CCF-C)

Product links

Use the related capabilities to jump from this paper into the toolchain or AiEDA modules.