Skip to main content
ACTIVITIES · DOC

iEDA-Chip-002

Second Tapeout: 20220812, 1.5M-gate-level processor chip designed in the "One Chip for a Lifetime" 110nm technology, third phase, achieved a 25MHz tapeout result;

Open EDAAI-readyCommunity docsLive TOC
doc — iEDA-Chip-002
# open iEDA stack
$ ieda open iEDA-Chip-002
[nav ] module linked         ok
[docs] pages indexed         ok
[ai  ] state exportable      ok
→ continue exploring
iMapsynthesisiFPfloorplaniPDNpoweriPLplacementiCTSclockiTOoptimizationiRTroutingiSTAtimingAiEDAdesign dataiPCLlayout modeliMapsynthesisiFPfloorplaniPDNpoweriPLplacementiCTSclockiTOoptimizationiRTroutingiSTAtimingAiEDAdesign dataiPCLlayout model
4Pages here
RTL→GDSOpen flow
AIExportable state
GPL-3.0License

Chip Parameters

Second Tapeout: 20220812, 1.5M-gate-level processor chip designed in the “One Chip for a Lifetime” 110nm technology, third phase, achieved a 25MHz tapeout result;

SoC Specifications:

  • A 11-stage, single-issue RV64I MAC processor core
  • AXI4 bus interconnect network, with an integrated PLL, designed with three clock domains
  • Integrated UART, QSPI Flash, ChipLink, SDRAM, VGA, PS/2 peripherals

Chip Parameters:

•Technology: 110nm
•Area: Approximately 4.8 × 4.8 cm
•Power Consumption: Dynamic = 343mW, Leakage = 21 mW
•Frequency: 25MHz
•Scale: 1.5M Gates
•Features: 11-stage pipeline with cache, IPs: UART, VGA, PS/2, SPI, SDRAM, two PLL modules output clocks, supports Linux

Layout Results

6
iEDA’s second tapeout of a chip design, layout, and board card test results

Build with open intermediate state

Every page connects back to executable tools and AI-ready design data.