Core capabilities
- Electromigration (EM) analysis: Assess metal interconnect EM lifetime from current density and wire width; identify high-risk nets.
- Aging analysis: Model NBTI/PBTI/HCI effects on threshold voltage and drive strength.
- Lifetime context: Expected lifetime under operating conditions for critical paths, supporting design margin decisions.
- Mitigation plans: Strategies for EM/aging hotspots—widen metal, add vias, device sizing.
- GREENFIELD roadmap: Start from external EM tool adapter; build in-house analysis models over time.
Agent calling patterns
em = client.call("iEM.check",
design_ref="snap_7f3a",
scenario="worst_current"
)
# em.em_hotspots → list[dict] (EM risk net list)
# em.lifetime_estimate → dict (critical-path MTF estimate)
# em.mitigation_plan → list[dict] (mitigation recommendations)Input / output contract
| Direction | Parameter | Type | Description |
|---|---|---|---|
| Input | design_ref | str | Design snapshot reference (post-route) |
| Input | scenario | str | Operating scenario: worst_current | typical | high_temp |
| Input | lifetime_target | float (optional) | Target lifetime (years), default 10 |
| Output | em_hotspots | list | EM risk hotspots: net, current_density, j_max, margin |
| Output | lifetime_estimate | dict | MTF estimate: worst path, average lifetime, temperature factor |
| Output | mitigation_plan | list | Mitigation plan: net, action, expected_lifetime_gain |
Role in the flow
01 Physical design
iFP · iPL · iCTS · iRT
Full place & route flow
02 Power analysis
iPA · iIR · iPDN
Power and IR-drop analysis
03 Reliability
iEM · iThermal
Joint EM/aging/thermal assessment
04 Signoff
iSTA · iDRC · iLVS
Final signoff with reliability constraints
iEM sits in the signoff stage, after power and thermal analysis, adding a reliability dimension to final signoff. Works with iThermal for temperature-dependent EM acceleration.
Related resources
- iPA — Power analysis: Current data is the core input for EM analysis.
- iThermal — Thermal analysis: Temperature distribution directly affects EM lifetime; joint analysis is more accurate.
- iPDN — Power network planning: Power networks are the primary subject of EM analysis.
- EDA tools overview: Map of all 22 point tools.